Advanced Adhesives In Electronics

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Advanced Adhesives In Electronics

Author : M O Alam
ISBN : 9780857092892
Genre : Technology & Engineering
File Size : 32.40 MB
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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Category: Technology & Engineering

Adhesives Technology For Electronic Applications

Author : James J. Licari
ISBN : 1437778909
Genre : Technology & Engineering
File Size : 70.8 MB
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Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel
Category: Technology & Engineering

Advanced Piezoelectric Materials

Author : Kenji Uchino
ISBN : 9781845699758
Genre : Technology & Engineering
File Size : 88.51 MB
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Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations
Category: Technology & Engineering

Polymers In Organic Electronics

Author : Sulaiman Khalifeh
ISBN : 9781927885680
Genre : Technology & Engineering
File Size : 67.14 MB
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Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system. Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Category: Technology & Engineering

Adhesion In Microelectronics

Author : K. L. Mittal
ISBN : 9781118831342
Genre : Technology & Engineering
File Size : 68.53 MB
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This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Category: Technology & Engineering

Electronics Applications Of Polymers Ii

Author : M.T. Goosey
ISBN : 1859572235
Genre : Chemistry, Organic
File Size : 68.10 MB
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Electronics applications of polymers continue to advance, and this report describes the major developments in the last decade. The report looks at the important properties of polymers and discusses their role in printed circuit board (PCB) and related interconnect applications and in microelectronics. Additionally, the various lithographic routes available for future semiconductor device manufacture are discussed. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database gives useful references for further reading.
Category: Chemistry, Organic

Advanced Organics For Electronic Substrates And Packages

Author : Andrew E Fletcher
ISBN : 9781483165615
Genre : Science
File Size : 44.52 MB
Format : PDF
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Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.
Category: Science

Electrically Conductive Adhesives

Author : Rajesh Gomatam
ISBN : 9789004165922
Genre : Technology & Engineering
File Size : 26.47 MB
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This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Category: Technology & Engineering

Nano Bio Electronic Photonic And Mems Packaging

Author : C.P. Wong
ISBN : 1441900403
Genre : Technology & Engineering
File Size : 54.32 MB
Format : PDF
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Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Category: Technology & Engineering

Handbook Of Adhesives And Sealants

Author : Philippe Cognard
ISBN : 0080534090
Genre : Technology & Engineering
File Size : 82.13 MB
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Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Category: Technology & Engineering

Graphene Carbon Nanotubes And Nanostructures

Author : James E. Morris
ISBN : 9781466560574
Genre : Technology & Engineering
File Size : 76.58 MB
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Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires. Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in a wide range of areas. Topics include: CNT electrodynamics and signal propagation models Electronic structure calculations of a graphene–hexagonal boron nitride interface to aid the understanding of experimental devices based on these heterostructures How a laser field would modify the electronic structure and transport response of graphene, to generate bandgaps The fabrication of transparent CNT electrodes for organic light-emitting diodes Direct graphene growth on dielectric substrates, and potential applications in electronic and spintronic devices CNTs as a promising candidate for next-generation interconnect conductors CMOS–CNT integration approaches, including the promising localized heating CNT synthesis method CNTs in electrochemical and optical biosensors The synthesis of diamondoids by pulsed laser ablation plasmas generated in supercritical fluids, and possible applications The use of DNA nanostructures in lithography CMOS-compatible silicon nanowire biosensors The use of titanium oxide-B nanowires to detect explosive vapors The properties of protective layers on silver nanoparticles for ink-jet printing Nanostructured thin-film production using microreactors A one-stop reference for professionals, researchers, and graduate students working in nanofabrication, this book will also be useful for investors who want an overview of the current nanofabrication landscape.
Category: Technology & Engineering

Engineered Materials Handbook

Author : Cyril A. Dostal
ISBN : 0871702819
Genre : Technology & Engineering
File Size : 48.5 MB
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Engineering adhesives and sealants, as defined herein, are polymer resin-base materials used in the manufacturing industries for joining structural elements (or sealing joints between them) so that the joints themselves become load-bearing elements of the structural systems in which they are located
Category: Technology & Engineering

Adhesives And Sealants

Author : David J. Dunn
ISBN : 1859573657
Genre : Technology & Engineering
File Size : 84.6 MB
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This unique report covers both technical and market information on adhesives and sealants in one volume. It provides an excellent analysis of the state-of-the-art in the adhesives and sealants industry. The report covers global market data and focuses on Western Europe and North America, with additional information about the emerging markets in the Far East and Latin America.
Category: Technology & Engineering

Materials For Advanced Packaging

Author : Daniel Lu
ISBN : 9783319450988
Genre : Technology & Engineering
File Size : 39.7 MB
Format : PDF
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Category: Technology & Engineering

Electronic Manufacturing

Author :
ISBN : CORNELL:31924058339296
Genre : Electronic circuits
File Size : 58.34 MB
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Category: Electronic circuits

Handbook Of Adhesives And Surface Preparation

Author : Sina Ebnesajjad
ISBN : 1437744621
Genre : Technology & Engineering
File Size : 31.5 MB
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Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard‐working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. A handbook that truly focuses on the applied aspects of adhesives selection and applications: this is a book that won't gather dust on the shelf Provides practical techniques for rendering materials surfaces adherable Sector‐based studies explore the specific issues for automotive and aerospace, medical, dental and electronics
Category: Technology & Engineering

Adhesive Bonding

Author : Robert D. Adams
ISBN : 0128199547
Genre :
File Size : 21.50 MB
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